| 摘要 |
A semiconductor device having improved physical and electrical properties includes a semiconductor chip comprising a first semiconductor substrate and a second semiconductor substrate on the first semiconductor substrate, conductive lines embedded in the first semiconductor substrate to be exposed on a surface of the first semiconductor substrate, a circuit structure formed on the second semiconductor substrate, and an external terminal formed on the circuit structure and electrically connected to the circuit structure, and an exposed surface of the first semiconductor substrate, where exposed surfaces of the conductive lines are located at the same plane.
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