发明名称 MULTILAYER FILM FORMING METHOD AND FILM FORMING APPARATUS USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer film forming method and a film forming apparatus that can suppress dispersion of the film thickness of a multilayer film to stabilize the quality of a product and reduce the cost of the apparatus and manufacturing. <P>SOLUTION: A multilayer film forming method for forming three or more layers having different raw material gas compositions on at least one surface of a substrate by gas-phase chemical reaction comprises a step of preparing for a film forming apparatus 100 which has first and second film forming portions 110, 120 along a feeding path of the substrate and has substrate supplying/withdrawing portions 101, 102 at both the ends of the feeding path, a first feeding/film forming step of simultaneously supplying first and second raw material gas having close compositions to the respective film forming portion to laminate and form plural layers containing first and second layers, and a second feeding/film forming step of forming a third layer different in composition from the first and second layers before or after the first feeding/film forming step. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012043983(A) 申请公布日期 2012.03.01
申请号 JP20100183974 申请日期 2010.08.19
申请人 FUJI ELECTRIC CO LTD 发明人 WADA KATSUHITO
分类号 H01L31/04 主分类号 H01L31/04
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