| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition excellent in dimensional stability of a cured product, excellent in low-temperature melting properties when partially cured (when entering B-stage), and shows less time change in viscosity, wherein the resin composition provides a film that is excellent in flexibility and is less likely to be curled when formed in a film shape at B-stage; to provide the cured product consisting of the resin composition; and to provide an interlayer adhesive film for print wiring board, obtained by using the resin composition. <P>SOLUTION: The thermosetting polyimide resin composition comprises: a thermosetting polyimide resin (A) that has a biphenyl skeleton directly bonding to a nitrogen atom in a five-membered imide skeleton and has a weight average molecular weight (Mw) of 3,000 to 150,000; and a polymaleimide compound (B) that has an aromatic ring and has a molecular weight of 200 to 1,000. The cured product is configured by curing the resin composition. The interlayer adhesive film for print wiring board has on a carrier film a layer formed by the resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
