| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that when a resistance element for temperature compensation is packaged in addition to a sensor chip, the package increases in size and the cost also increases. <P>SOLUTION: The present invention relates to the sensor chip including a sensor circuit formed on a substrate; a first resistance element formed on the substrate; a second resistance element formed on the substrate while connected to the first resistance element in series, and having a temperature coefficient different from that of the first resistance element; and a pad outputting a potential at a connection point between the first resistance element and the second resistance element and a pad outputting the output of the sensor circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
