| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a card module in which more electronic components can be mounted. <P>SOLUTION: A card module includes a top case, a bottom case, a substrate placed between the bottom case and the top case, and a terminal substrate connected to the substrate. In a space surrounded by the top case and the bottom case, electronic components mounted on the substrate are placed. The terminal substrate is exposed at the bottom case side. One surface of the terminal substrate is provided with a connection terminal connected to a connection terminal provided on the substrate, and the other surface of the terminal substrate is provided with an electrode terminal exposed at the bottom case side. The connection terminal and the electrode terminal provided on the terminal substrate are connected through a through hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
