| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free composition for forming a thick film conductor which excels in both sulfide resistance and solder resistance at low cost. <P>SOLUTION: The present invention relates to a composition used for forming a thick film conductor which is used as an electrode of a chip resistor. The composition of the present invention contains Ag powder as conductive powder and SiO<SB POS="POST">2</SB>-B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>-Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>-CaO-Li<SB POS="POST">2</SB>O-group glass powder and Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>powder as oxide powder, and also has carbon powder added as additive. Per 100 pts.mass of conductive powder, there are included 1-10 pts.mass of the carbon powder, 0.1-15 pts.mass of the glass powder, and 0.1-8 pts.mass of the Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>powder. The composition of the glass powder is SiO<SB POS="POST">2</SB>:20-60 mass%, B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>:2-25 mass%, Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>:2-25 mass%, CaO:20-50 mass%, and Li<SB POS="POST">2</SB>O:0.5-6 mass%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
