| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTION STRUCTURE, SEMICONDUCTOR DEVICE, AND SOLAR CELL MODULE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition obtainable of sufficient supporting force or temporary fixing force even when the time to temporary fix is short that has excellent adhesive strength after finally connecting. <P>SOLUTION: The adhesive composition contains: acrylic rubber having 5-18 mass% of a structural unit derived from acrylonitrile; urethane acrylate; and a radical polymerization initiator. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012041525(A) |
申请公布日期 |
2012.03.01 |
| 申请号 |
JP20110156667 |
申请日期 |
2011.07.15 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
KUDO SUNAO;IZAWA HIROYUKI;ARIFUKU MASAHIRO;KOBAYASHI KOJI;FUJIEDA TADAYASU;MATSUDA KAZUYA;FUJINAWA MITSUGI |
| 分类号 |
C09J133/20;C09J4/02;C09J4/06;C09J5/06;C09J7/00;C09J9/02;C09J155/00;H01B1/20;H01B5/16;H01L21/60;H05K1/14;H05K3/32;H05K3/36 |
主分类号 |
C09J133/20 |
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