| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicone resin composition for an optical semiconductor case which gives a cured product which excels in adhesion with a transparency sealing resin, and in which heat resistance and ultraviolet resistance are good. <P>SOLUTION: The silicone resin composition includes: (A) 100 pts.mass of a thermosetting organopolysiloxane; (B) R<SP POS="POST">2</SP>SiO<SB POS="POST">3/2</SB>unit, R<SP POS="POST">2</SP><SB POS="POST">2</SB>SiO unit, and R<SP POS="POST">3</SP><SB POS="POST">a</SB>R<SP POS="POST">4</SP><SB POS="POST">b</SB>SiO<SB POS="POST">(4-a-b)/2</SB>unit (wherein R<SP POS="POST">2</SP>is a hydroxy group or a monovalent 1-10C hydrocarbon group excluding an alkenyl group, R<SP POS="POST">4</SP>is a 2-8C alkenyl group, R<SP POS="POST">3</SP>is R<SP POS="POST">2</SP>or R<SP POS="POST">4</SP>, a is 0, 1 or 2, b is 1 or 2, and a+b is 2 or 3); 3-300 pts.mass of an organopolysiloxane including a unit expressed by formula (1) (wherein 0≤m≤100, 0≤n≤100, and 5≤m+n≤100); and (E) 0.01-10 pts.mass of a curing catalyst. <P>COPYRIGHT: (C)2012,JPO&INPIT |
