| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which exhibits excellent heat resistance and flame retardancy as a cured product and further an excellent adhesive strength between layers in the application for printed wiring boards, and to provide an epoxy resin composition suitable to be used for the main ingredient of the curable resin composition, a cured product of the curable resin composition, and a printed wiring board having excellent heat resistance, flame retardancy and adhesiveness. <P>SOLUTION: The epoxy resin composition contains polyglycidyl ether (a1), which is a polymerization product of a naphthol based compound (a2) and formaldehyde, and a glycidyl oxy-naphthalene based compound as necessary components. Also, the content rate of the glycidyl oxy-naphthalene based compound (a2) on the basis of a peak area in the composition measured by GPC measurement is 1-10%. The epoxy resin composition is used as a main ingredient of the curable resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
