发明名称 SOLVENTLESS ADDITION-CURABLE PRESSURE SENSITIVE SILICONE ADHESIVE COMPOSITION AND ADHESIVE ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solventless addition-curable pressure sensitive silicone adhesive composition which has flexibility, pressure sensitive adhesiveness and heat resistance, and is usable as a buffer member, and an adhesive article composed of the cured matter of the composition. <P>SOLUTION: The composition comprises: (A) an alkenyl group-containing polydiorganosiloxane; (B) a condensation product of (a) a polydiorganosiloxane having hydroxyl group or an alkoxy group on opposite ends of the molecular chain and (b) a polyorganosiloxane containing R<SP POS="POST">1</SP><SB POS="POST">3</SB>SiO<SB POS="POST">1/2</SB>unit and SiO<SB POS="POST">2</SB>unit as critical components and also a HOSiO<SB POS="POST">3/2</SB>unit in the molecule; (C1) a polyorganohydrosiloxane having at least three SiH groups per molecule; (C2) a polydiorganohydrosiloxane having SiH groups on opposite ends; and (D) a platinum group metal catalyst. Use of the present composition enables production of a pressure sensitive adhesive agent having flexibility, pressure sensitive adhesiveness, and heat resistance, and the present composition is particularly effective for use as a buffer member having pressure sensitive adhesiveness. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012041505(A) 申请公布日期 2012.03.01
申请号 JP20100186334 申请日期 2010.08.23
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 AOKI SHUNJI
分类号 C09J183/07;C09J7/00;C09J11/06;C09J183/04;C09J183/05 主分类号 C09J183/07
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