发明名称 EMBEDDED MULTI-LAYER CIRCIUT BOARD AND NOISE SUPPRESSION METHOD
摘要 The invention relates to an embedded multi-layer circuit board and a noise suppression method. The embedded multi-layer circuit board comprises at least two ground layers, a power layer and a plurality of vias. The power layer is between two ground layers. Each via is electrically connected with the two ground layers and electrically isolated from the power layer. The power layer is divided to a plurality of periodical cells. Each cell comprises the same number of the vias.
申请公布号 US2012048611(A1) 申请公布日期 2012.03.01
申请号 US201113045695 申请日期 2011.03.11
申请人 WU TZONG-LIN;HUANG CHUNG-HSIANG;NATIONAL TAIWAN UNIVERSITY 发明人 WU TZONG-LIN;HUANG CHUNG-HSIANG
分类号 H05K1/11;H05K3/42 主分类号 H05K1/11
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