| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for circuit member connection enabling identification of a recognition mark on a face of a chip circuit through the adhesive for circuit member connection during connection of circuit members while inhibiting generation of a conduction failure and enabling stable and low connection resistance after connection of the circuit members. <P>SOLUTION: The thermoset adhesive for circuit member connection includes a resin composition containing thermal cross-linking resin and a curative agent reacting with the thermal cross-linking resin, and complex oxide particles of crystallized metal oxide containing more than one type of metal dispersed in the thermal cross-linking resin. The adhesive bonds a semiconductor chip having protruding connection terminals and a circuit board having a wiring pattern such that the connection terminals and the wiring pattern are electrically connected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
