| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve cooling efficiency for a semiconductor device on which a heat sink is mounted. <P>SOLUTION: A semiconductor device 100 comprises: a wiring board 120; a semiconductor chip 140; a sealing resin 180; and a heat sink 200. In an embodiment, the wiring board 120 is a metal lead frame. The semiconductor chip 140 is mounted on the wiring board 120 with an electrode pad facing upward. The sealing resin 180 is used for sealing the wiring board 120 and the semiconductor chip 140. Further, the heat sink 200 is provided on the semiconductor chip 140 side of the sealing resin 180. The heat sink 200 includes a base plate 220 and at least one fin 240. The base plate 220 has an extension area 202 which does not overlap an upper surface of the sealing resin 180, and the fin 240 is placed on at least the extension area 202. <P>COPYRIGHT: (C)2012,JPO&INPIT |
