| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a plurality of redundant vias from being annihilated due to alignment deviation even when one portion of a plurality of vias arranged and formed on a wiring includes the redundant vias. <P>SOLUTION: The semiconductor device includes a plurality of vias 5 (5a-5c) arranged and formed on a linear wiring 4, in which at least one portion of the plurality of vias 5 is formed as redundant vias 5 and at least one portion of the vias 5 is formed on a location that is deviated from a center line of the wiring 4. Therefore, at least one redundant via of the redundant vias 5 can be formed with reduced influence of alignment deviation even when the alignment deviation occurs in the wiring 4 and the vias 5 in photoresist patterning. <P>COPYRIGHT: (C)2012,JPO&INPIT |
