| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus for substrates, the apparatus capable of appropriately bonding two substrates by pressing a sealing agent in a frame-like pattern to be pressurized between two substrates, with a uniform along the whole perimeter of the frame. <P>SOLUTION: The bonding apparatus 10 for substrates includes a plurality of elastic bodies 30a laid in such a manner that the layout density of the elastic bodies 30a disposed at positions facing a part of the substrate 41 where a dummy sealing agent 51 is applied is higher than the layout density of the elastic bodies 30a disposed at positions facing a part of the substrate 41 where no dummy sealing agent 51 is applied. <P>COPYRIGHT: (C)2012,JPO&INPIT |
