| 摘要 |
<p>An imaging device provided with a glass substrate (31) and flexible printed circuit boards (F). The following are formed on the glass substrate: a sensor chip (6) that has pad electrodes (48) via which electrical signals to be supplied to a pixel array (10) are inputted; first wiring patterns (32a and 32b) connected to signal lines via which signals from the pixel array (10) are outputted; and second wiring patterns (47) connected to the pad electrodes (48). The flexible printed circuit boards have: an upper signal-processing chip (7) and lower signal-processing chip (8) that have pad electrodes (38) via which signals processed via signal-processing circuits are outputted; FPC wiring (40) electrically connected to said pad electrodes (38); and FPC wiring (42) electrically connected to the second wiring patterns (47) formed on the glass substrate (31).</p> |
