发明名称 WIRE BONDING SYSTEM
摘要 The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.
申请公布号 US5199629(A) 申请公布日期 1993.04.06
申请号 US19910810115 申请日期 1991.12.19
申请人 ROHM CO., LTD. 发明人 SAWASE, KENSUKE;OGATA, HIROMI
分类号 H01L21/60;G06K15/12 主分类号 H01L21/60
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