| 摘要 |
<p>The invention provides a lead wire framework, which comprises a pipe core pad and a plurality of lead wires.A semiconductor chip is arranged on the pipe core pad.The plurality of lead wires arranged on the periphery of the pipe core pad are electrically connected with the semiconductor chip arranged on the pipe core pad.Part of the plurality of lead wires are connected with each other, so that a lead wire group is provided.</p> |
