Fluidic modules with enhanced thermal characteristics

摘要

A fluidic module (100) is provided comprising at least two independent sets (10A,10B) of fluid microchannels (10), a network of glass channel walls (20), one or more thermal exchange partitions (30), and one or more bonding layers (40). The network of glass channel walls (20) defines fluid flow paths of the fluid microchannels (10).The fluid microchannels (10) are configured such that at least a portion of the fluid flow path of one set of microchannels (10A) is partitioned from a portion of the fluid flow path of another set of microchannels (10B) by a thermal exchange partition (30). The thermal exchange partition (30) comprises a non-glassy composition having a thermal conductivity greater than approximately 15 W/(m'K). Respective channel wall end portions (25) of the network of channel walls (20) interface with the thermal exchange partition (30) via one or more bonding pads defined by the bonding layer (40). The bonding layer (40) comprises a glass composition having a thermal conductivity that is less than the thermal conductivity of the thermal exchange partition (30) and a coefficient of thermal expansion that approximates the coefficient of thermal expansion of the thermal exchange partition (30). The bonding pads defined by the bonding layer (40) lie between the channel wall end portions (25) of the network of glass channel walls (20) and the thermal exchange partition (30) and the bonding layer (40) extends at least partially along the thermal exchange partition (30) into the fluid flow paths of the fluid microchannels (10), as defined by the network of glass channel walls (20).