发明名称
摘要 PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive material capable of exhibiting excellent adhesive force even to an adherend of temperatures or under environmental temperatures from a low temperature to a high temperature, and to provide a method for heat-activating the adhesive material and a method for attaching the heat-sensitive adhesive material. SOLUTION: This heat-sensitive adhesive material is obtained by providing a heat- sensitive adhesive layer consisting mainly of a thermoplastic resin and a solid plasticizer on a support and including mixed fine particles of heat-melting compound (a compound A) capable of lowering coagulation point of the solid plasticizer with a heat- responsible control compound (a compound B) capable of controlling heat responsibility of the compound A into the heat-sensitive adhesive layer and/or a layer adjacent to the heat-sensitive adhesive layer. This method for attaching the heat-sensitive adhesive material comprises heating and activating the heat-sensitive adhesive material from a heat-sensitive adhesive layer-forming surface to develop adhesive force of the heat-sensitive adhesive material and then attaching the heat-sensitive adhesive material in which the tacky force is developed to an adherend. The method for heat- activating the heat-sensitive adhesive material is also provided.
申请公布号 JP4884617(B2) 申请公布日期 2012.02.29
申请号 JP20010285124 申请日期 2001.09.19
申请人 发明人
分类号 B41M5/28;C09J7/02;B41M5/26;B41M5/30;B41M5/40;C09J11/00;C09J133/08;C09J201/00;G09F3/10 主分类号 B41M5/28
代理机构 代理人
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