LED PACKAGE COMPRISING CAVITY FORMED BY ETCHING AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: An LED package including a cavity and a manufacturing method thereof are provided to implement a precise pattern by forming the cavity on a ceramic substrate with an etching process. CONSTITUTION: A via hole passes through a ceramic substrate. A cavity is formed by etching the ceramic substrate. A screen mask with an opening corresponding to the via hole is arranged. Conductive ink is coated on the screen mask. An electrode pattern hole(150a,150b) is formed by filling conductive ink in the via hole. An LED chip(160) is mounted in the cavity and is electrically connected to the electrode pattern hole.