发明名称 |
Lateral connection for a via-less thin film resistor and method of forming the same |
摘要 |
The present disclosure is directed to an integrated circuit (100) having a substrate (108) and a first and a second interconnect structure (104a,b) over the substrate. Each interconnect structure has a first conductive layer (106) over the substrate and a second conductive layer (124) over the first conductive layer. The integrated circuit also includes a thin film resistor (102) over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures. |
申请公布号 |
EP2423948(A2) |
申请公布日期 |
2012.02.29 |
申请号 |
EP20110178590 |
申请日期 |
2011.08.24 |
申请人 |
STMICROELECTRONICS PTE LTD. |
发明人 |
NG, HUI CHONG VINCE;LE NEEL, OLIVIER;LEUNG, CALVIN |
分类号 |
H01L49/02;H01L23/522 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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