| 摘要 |
A contact adapted for electrically connecting with an IC package and a printed circuit board, comprises a base portion adapted for being retained to an insulating housing, a solder portion extending from a lower end of the base portion and a turned portion bent downwardly from one end of the base portion. The solder portion is adapted for soldering the contact to the printed circuit board. The contact further includes a resilient arm extending upwardly from a bottom end of the turned portion. The resilient arm has an inclined portion and a cantilever beam. The inclined portion is connecting with the turned portion. The cantilever extends upwardly from a top end of the inclined portion and toward the turned portion to lengthen the resilient arm of the contact. Housing cavities may be formed to cause pre-loading of the resilient arms as they are inserted into the cavities.
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