发明名称 Methods and apparatus for an integrated instrumentation module for a thermal protection system
摘要 An integrated instrumentation system includes a body comprising a thermal protection system (TPS) material (e.g., an ablatable material), one or more sensors embedded within the body, and a processor (e.g., an FPGA or the like) communicatively coupled to the plurality of sensors. The processor is configured to acquire sensor signals from the plurality of sensors and produce digital sensor data associated therewith. The sensors may include, for example, recession sensors, pressure transducers, thermocouples, and accelerometers.
申请公布号 US8123174(B2) 申请公布日期 2012.02.28
申请号 US20070766046 申请日期 2007.06.20
申请人 ANDREWS THOMAS L.;PELTZ LEORA;FRAMPTON ROBERT V.;THE BOEING COMPANY 发明人 ANDREWS THOMAS L.;PELTZ LEORA;FRAMPTON ROBERT V.
分类号 B64G1/66 主分类号 B64G1/66
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