| 发明名称 |
Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module |
| 摘要 |
In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved. |
| 申请公布号 |
US8125792(B2) |
申请公布日期 |
2012.02.28 |
| 申请号 |
US20080330686 |
申请日期 |
2008.12.09 |
| 申请人 |
KAWABATA TAKESHI;PANASONIC CORPORATION |
发明人 |
KAWABATA TAKESHI |
| 分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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