发明名称 |
Integrated circuit package system employing an exposed thermally conductive coating |
摘要 |
An integrated circuit package system includes providing a leadframe that is coplanar with a bottom surface of the integrated circuit package system to which is attached a device with a thermally conductive coating that is coplanar with the bottom surface of the integrated circuit package system to the leadframe, the device having the characteristics of being singulated from a wafer and the thermally conductive coating having the characteristics of being singulated from a wafer level thermally conductive coating and encapsulating the device with an encapsulation material that leaves the thermally conductive coating exposed for thermal dissipation. |
申请公布号 |
US8124460(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20060458078 |
申请日期 |
2006.07.17 |
申请人 |
CHOW SENG GUAN;KUAN HEAP HOE;STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;KUAN HEAP HOE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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