| 发明名称 |
Integrated circuit mount system with solder mask pad |
| 摘要 |
An integrated circuit mount system includes an integrated circuit, a solder mask for the integrated circuit, and a solder mask pad on the substrate with the solder mask. |
| 申请公布号 |
US8124520(B2) |
申请公布日期 |
2012.02.28 |
| 申请号 |
US20060456551 |
申请日期 |
2006.07.10 |
| 申请人 |
KIM KYUNGOE;CHOI HAENGCHEOL;KIM KYUNG MOON;PENDSE RAJENDRA D.;STATS CHIPPAC LTD. |
发明人 |
KIM KYUNGOE;CHOI HAENGCHEOL;KIM KYUNG MOON;PENDSE RAJENDRA D. |
| 分类号 |
H01L23/52;H01L21/00 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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