发明名称 Method for manufacturing a semiconductor device having a source extension region and a drain extension region
摘要 There is provided a semiconductor device including: convex semiconductor layers formed on a semiconductor substrate via an insulating film; gate electrodes formed on a pair of facing sides of the semiconductor layers via a gate insulating film; a channel region formed of silicon between the gate electrodes in the semiconductor layers; a source extension region and a drain extension region formed of silicon germanium or silicon carbon on both sides of the channel region in the semiconductor layers; and a source region formed of silicon so as to adjoin to the opposite side of the channel region in the source extension region, and a drain region formed of silicon so as to adjoin to the opposite side of the channel region in the drain extension region in the semiconductor layers.
申请公布号 US8124465(B2) 申请公布日期 2012.02.28
申请号 US20100748032 申请日期 2010.03.26
申请人 YAGISHITA ATSUSHI;KABUSHIKI KAISHA TOSHIBA 发明人 YAGISHITA ATSUSHI
分类号 H01L21/336 主分类号 H01L21/336
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