| 摘要 |
A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when a chip is picked up. This film for semiconductor is characterized in that in the case where peel strength at 23°C of the chip is defined as "Fn (cN/25mm)" and peel strength at 60°C of the chip is defined as "F60 (cN/25mm)", Fn is in the range of 10 to 80 and F60/F23 is in the range of 0.3 to 5.5. This makes it possible to improve a pickup property of the chip, to thereby prevent generation of defects in a semiconductor element. 11111111111111111111_ *162162* |
