| 摘要 |
<p>METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENTA method for bonding a first wafer (100) on a second wafer (200) by molecular adhesion, the said wafers having an initial radial misalignment between them. The said method comprises at least one step of bringing the two wafers (100, 200) into contact so as to initiate the propagation of a bonding wave between the two wafers. According to theinvention, a predefined bonding curvature (K[err]) is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.Fig. 5D and 5E</p> |
