| 摘要 |
OF THE DISCLOSUREA solution for semiconductor wafer dicing is disclosed. The solution suppresses 5 the adherence of contamination residues or particles, and reduces or eliminates thecorrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equalor greater than 4. The solution can further comprise, a chelating agent, a defoaming 10 agent, or a dispersing agent.Fig. 1 |
