发明名称 |
Semiconductor device system in package |
摘要 |
A semiconductor device includes, in one package: a plurality of semiconductor chips having different operating voltages; and a power supply circuit configured to receive an input voltage from an external power supply and supply operating voltages to the semiconductor chips. The power supply circuit is capable of switching and supplying a plurality of different voltages for each one of the semiconductor chips. |
申请公布号 |
US8125103(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20090364569 |
申请日期 |
2009.02.03 |
申请人 |
ITO SHUICHI;KABUSHIKI KAISHA TOSHIBA |
发明人 |
ITO SHUICHI |
分类号 |
H02J1/00;G01R31/26;H01H33/59;H03L5/00 |
主分类号 |
H02J1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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