发明名称 Method and apparatus for visual inspection
摘要 In the case of die-to-die comparison, threshold processing units process the differential image between the image of a sample chip and the images of left and right adjacent chips using a second threshold value lower than a first threshold value thereby to determine a defect candidate for the sample chip. Further, threshold processing units process the differential image using the first threshold value. The defect candidates which develops a signal not smaller than the first threshold is detected as a defect. Also in the cell-to-cell comparison, the differential image is first processed by the second threshold value to determine a defect candidate, and the differential image is further processed by the first threshold value. The defect candidates which develops a signal not smaller than the first threshold value is detected as a defect.
申请公布号 US8126259(B2) 申请公布日期 2012.02.28
申请号 US20100755596 申请日期 2010.04.07
申请人 SHIMURA KEI;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 SHIMURA KEI
分类号 G06K9/00 主分类号 G06K9/00
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