发明名称 |
Integrated circuit packaging system with interposer |
摘要 |
An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.
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申请公布号 |
US8124451(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20070859359 |
申请日期 |
2007.09.21 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
SONG SUNGMIN;LEE SEONGMIN;KO WONJUN |
分类号 |
H01L21/00;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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