发明名称 |
Method for soldering with a multistep temperature profile |
摘要 |
A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.
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申请公布号 |
US8123110(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20100897249 |
申请日期 |
2010.10.04 |
申请人 |
BERGER INGO;MUENZER JAN;REINKENSMEIER INGO;SETTEGAST SILKE;SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BERGER INGO;MUENZER JAN;REINKENSMEIER INGO;SETTEGAST SILKE |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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