FLOOR WITH A HEAT CONDUCTIVE STRUCTURE

摘要

PURPOSE: A floor material having a heat conductive structure is provided to improve heat conductivity by filling grooves formed in a base panel with a material having excellent thermal efficiency. CONSTITUTION: A floor material having a heat conductive structure comprises a base panel(100), filling grooves(200), tongue and groove members(300,400), a decoration layer(500), and a decoration protection layer(600). The filling grooves are formed in the bottom of the base panel and are filled with heat conductive materials. The tongue and groove members are formed on both side surfaces of the base panel. The decoration layer is formed on the top surface of the base panel to finish the exterior of the base panel. The decoration protection layer is formed on the top surface of the decoration layer.