发明名称 Manufacturing method of advanced quad flat non-leaded package
摘要 The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.
申请公布号 US8124447(B2) 申请公布日期 2012.02.28
申请号 US20090547787 申请日期 2009.08.26
申请人 CHANG CHIEN PAO-HUEI;HU PING-CHENG;CHIANG PO-SHING;CHENG WEI-LUN;ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 CHANG CHIEN PAO-HUEI;HU PING-CHENG;CHIANG PO-SHING;CHENG WEI-LUN
分类号 H01L21/00 主分类号 H01L21/00
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