SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to fix a thermal conductive plug to an EMC in a package stage by forming a heat dissipation pad in a step of manufacturing a semiconductor chip. CONSTITUTION: A semiconductor chip(110) is mounted in a wiring board(130). An adhesive member(140) physically interlinks the semiconductor chip and the wiring board. A connecting member(150) electrically interlinks the semiconductor chip and the wiring board. A molding material(160) protects the semiconductor chip and the connecting member from an external impact. A thermal conductance via plug(200) emits the heat from the semiconductor chip to outside.