DEVICE EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A flexible printed circuit board equipped with a device and a manufacturing method thereof are provided to improve the degree of integration of components and to reduce the number of assembling processes and to improve response speed by shortening wiring length. CONSTITUTION: A first insulation layer(200) is arranged on the upper side of a first conductive layer. A first groove(220) is formed on the first insulation layer as a shape corresponding to a plurality of bump grooves and a first circuit pattern. A first plating layer(400) is formed within the first groove of the first insulation layer. A semiconductor device(500) is inserted into a bump groove and comprises a plurality of bumps connected to the first conductive layer. A second circuit pattern is formed on the first conductive layer. The first conductive layer is a copper layer of a flexible copper clad laminate film. The first insulation layer is a core layer of the flexible copper clad laminate film.