发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A light emitting diode package is provided to improve the reliability of an LED package by adopting a lead frame having a pattern structure. CONSTITUTION: A package body(21) accepts an LED chip(24). The package body comprises a cavity(211) having a slope upper part. An LED chip is electrically connected to lead frames(22,23). A molding unit(25) solders the LED chip and a bonding wire(W). A pattern(30) is formed in the lower part of the lead frame.
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申请公布号 |
KR20120016787(A) |
申请公布日期 |
2012.02.27 |
申请号 |
KR20100079234 |
申请日期 |
2010.08.17 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
OH, KWANG YONG;CHUNG, MIN YOUNG |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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