发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A light emitting diode package is provided to improve the reliability of an LED package by adopting a lead frame having a pattern structure. CONSTITUTION: A package body(21) accepts an LED chip(24). The package body comprises a cavity(211) having a slope upper part. An LED chip is electrically connected to lead frames(22,23). A molding unit(25) solders the LED chip and a bonding wire(W). A pattern(30) is formed in the lower part of the lead frame.
申请公布号 KR20120016787(A) 申请公布日期 2012.02.27
申请号 KR20100079234 申请日期 2010.08.17
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 OH, KWANG YONG;CHUNG, MIN YOUNG
分类号 H01L33/62 主分类号 H01L33/62
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