发明名称 METHOD OF FORMING A WIRING STRUCTURE
摘要 A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.
申请公布号 KR101110804(B1) 申请公布日期 2012.02.24
申请号 KR20100057016 申请日期 2010.06.16
申请人 发明人
分类号 H01L23/52;H01L21/3205 主分类号 H01L23/52
代理机构 代理人
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