发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS USING SEQUENTIAL MULTI-FOCUSING
摘要 PURPOSE: A laser machining method and apparatus using sequential multi-focusing are provided to prevent the scattering of a laser beam caused by an upper crack row because a lower crack row is formed earlier than the upper crack row inside an work piece. CONSTITUTION: A laser machining method is as follows. A plurality of laser beams(L,L1,L2,L3) are focused on the inside of an work piece(10) to form a plurality of focusing spots(S1,S2,S3). The focusing spots are sequentially arranged at a predetermined depth from a surface(10a) of the work piece. Either the laser beams or the work piece is moved in a first direction and a plurality of crack rows corresponding to the focusing spots are formed inside the work piece.
申请公布号 KR20120016457(A) 申请公布日期 2012.02.24
申请号 KR20100078827 申请日期 2010.08.16
申请人 EO TECHNICS CO., LTD. 发明人 CHUNG, YOUNG DAE;SEONG, CHEON YA;KIM, HYUN GUK;LEE, KAM MYUNG;KIM, HWAN
分类号 B23K26/046;B23K26/064 主分类号 B23K26/046
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