发明名称 |
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS USING SEQUENTIAL MULTI-FOCUSING |
摘要 |
PURPOSE: A laser machining method and apparatus using sequential multi-focusing are provided to prevent the scattering of a laser beam caused by an upper crack row because a lower crack row is formed earlier than the upper crack row inside an work piece. CONSTITUTION: A laser machining method is as follows. A plurality of laser beams(L,L1,L2,L3) are focused on the inside of an work piece(10) to form a plurality of focusing spots(S1,S2,S3). The focusing spots are sequentially arranged at a predetermined depth from a surface(10a) of the work piece. Either the laser beams or the work piece is moved in a first direction and a plurality of crack rows corresponding to the focusing spots are formed inside the work piece. |
申请公布号 |
KR20120016457(A) |
申请公布日期 |
2012.02.24 |
申请号 |
KR20100078827 |
申请日期 |
2010.08.16 |
申请人 |
EO TECHNICS CO., LTD. |
发明人 |
CHUNG, YOUNG DAE;SEONG, CHEON YA;KIM, HYUN GUK;LEE, KAM MYUNG;KIM, HWAN |
分类号 |
B23K26/046;B23K26/064 |
主分类号 |
B23K26/046 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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