LASER PROCESSING METHOD USING SURFACE SCRIBING

摘要

PURPOSE: A laser processing method using surface scribing is provided to easily cut a work piece without damage to a semiconductor device laminated on the work piece because a scribing line is formed on the surface of the work piece when crack rows are formed inside the work piece. CONSTITUTION: A laser processing method using surface scribing is as follows. A laser beam(L) is focused in a fixed position inside a work piece(100). Either the laser beam or the work piece is moved in a first direction and an inner crack is formed at a predetermined depth from the surface of the work piece and, at the same time, a scribing line(152) corresponding to the inner crack is formed on the surface of the work piece.