| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent dust from entering an internal space of a printhead 60 even in a configuration where a through-hole 78 passing through a mounting surface 64A from a back surface 64B is provided in a circuit substrate 64. <P>SOLUTION: The through-hole 78 is disposed in an application region R2 where a sealing agent is applied. Accordingly, the dust is prevented from entering the inner space of the printhead 60 in the configuration where the through-hole 78 through the mounting surface 64A from the back surface 64B is provided in the circuit substrate 64 in comparison with a configuration where the through-hole 78 is disposed in the application region R2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
