发明名称 SPECTROSCOPIC MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a spectroscopic module capable of easily being mass-produced by a wafer process while achieving miniaturization. <P>SOLUTION: Since a body part 2 has a plate-like shape, a spectroscopic module 1 can be miniaturized by reducing thickness of the body part 2. In addition, since the body part 2 has the plate-like shape, the spectroscopic module 1 can be manufactured by using, for instance, a wafer process. That is to say, lens parts 3, diffraction layers 4, reflective layers 6 and light detection elements 7 are formed in a matrix-like shape on a glass wafer used as the multiple body parts 2, and the glass wafer is subjected to dicing, whereby the multiple spectroscopic modules 1 can be manufactured. Thus the spectroscopic modules 1 can be easily mass-produced. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012037533(A) 申请公布日期 2012.02.23
申请号 JP20110252646 申请日期 2011.11.18
申请人 HAMAMATSU PHOTONICS KK 发明人
分类号 G01J3/18 主分类号 G01J3/18
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