| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new method of attaching and connecting molecules. <P>SOLUTION: A method of adhering and connecting molecules between at least a first wafer (20) and a second wafer (30) includes the steps of at least performing mechanical positioning; making the two wafers (20) and (30) come into contact with each other; and starting propagation of a connection wave between the two wafers. During the steps of performing mechanical positioning and making the two wafers come into contact, the wafers are located in an environment under a first pressure (P1) equal to or larger than a predetermined pressure threshold. During the step of starting propagation of the connection wave, the wafers (20) and (30) are located in an environment under a second pressure (P2) less than the predetermined pressure threshold. <P>COPYRIGHT: (C)2012,JPO&INPIT |
