发明名称 |
METHOD OF FORMING MULTILAYER CONDUCTOR LINE, AND ELECTRONIC PAPER PANEL USING THE SAME |
摘要 |
Disclosed herein are a method of forming a multilayer conductor line and an electronic paper panel using the same. The electronic paper panel includes a substrate: a lower electrode disposed on the upper portion of the substrate and formed with a wiring layer to electrically connect each of the segments so that it drives an electronic paper; an upper electrode disposed on the upper portion of the lower electrode to display information to be represented; an insulating layer disposed between the upper electrode and the lower electrode; a driving chip mounted on the upper surface of the lower electrode, whereby the conductor lines can be designed in the multilayer structure type at the time of forming the conductor lines of the electronic paper panel, such that it is possible to variously design the conductor lines even though the substrate size is small. |
申请公布号 |
US2012044220(A1) |
申请公布日期 |
2012.02.23 |
申请号 |
US20100962237 |
申请日期 |
2010.12.07 |
申请人 |
LEE JAE CHAN;KIM HYUN HAK;BYUN GI YOUNG;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE JAE CHAN;KIM HYUN HAK;BYUN GI YOUNG |
分类号 |
G09G5/00;H01J9/24 |
主分类号 |
G09G5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|