| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simply structured semiconductor device without increasing manufacturing processes. <P>SOLUTION: A semiconductor device 10 comprises a heat sink 1, a semiconductor chip 2 disposed on the heat sink 1, and an insulator 3 for sealing the semiconductor chip 2. The heat sink 1 includes a protrusion 4 protruding in the arrangement direction of the semiconductor chip 2. The protrusion 4 has a mounting hole 5 penetrating the protrusion 4 along the protruding direction of the protrusion 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
