INDUCTION HEATING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate thermal treatment device that allows excellent heating control by suppressing an influence of mutual induction between induction heating coils even when the induction heating coils are provided in a vertical direction while a horizontal magnetic flux is applied to a susceptor.

SOLUTION: A thermal treatment device 10 for indirectly heating a wafer 54 mounted on a susceptor 52 disposed horizontally comprises an induction heating coil for forming an AC magnetic flux in a direction parallel to a plane of the susceptor 52 on which the wafer 54 is mounted. The induction heating coil includes at least one main heating coil 30 and sub heating coils 32 and 34 electromagnetically coupled with the main heating coil 30. The main heating coil 30 is provided with reverse coupling coils 36 and 38 which are electromagnetically reversely coupled with the sub heating coils 32 and 34, and zone controlling means 22 for individually controlling the power proportion while synchronizing the frequency and current waveform of the current applied to the main heating coil 30 and the sub heating coils 32 and 34 disposed adjacent to each other.

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