| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic equipment of high reliability which prevents wire disconnection caused by expansion and constriction of residual air bubbles. <P>SOLUTION: A first encapsulation resin 12a is applied to element electrodes 6 in a line in the arrangement direction of the element electrodes 6. Next, a second encapsulation resin 12b is applied to a packaging substrate electrode 7 of a packaging substrate 2 in a line in the arrangement direction of the packaging substrate electrode 7. Next, a third encapsulation resin 12c is applied to cover the spaces between the ends of the first encapsulation resin 12a applied to the side of an element 1 and the second encapsulation resin 12b applied to the side of the packaging substrate 2. Finally, a fourth encapsulation resin 12d is applied gradually to a space part 13 surrounded by three sides made by the encapsulation resins 12a, 12b, and 12c from the side face part of the third encapsulation resin 12c to an open part opposite to the side face part. By this operation, bubbles 14 generated at the time of application can escape at the time of application. <P>COPYRIGHT: (C)2012,JPO&INPIT |
